San Jose, CA, May 07, 2024 (GLOBE NEWSWIRE) -- Alchip Technologies, Ltd. the high-performance ASIC leader, highlighted its recent accomplishments and future direction at its TSMC's 2024 Technology ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium.

Siemens and TSMC expand AI, 3D IC, and packaging design enablement, certifying software for advanced process technologies. At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital full flow and custom/analog tool suites have been further enhanced to deliver optimal ...

New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff Certified EDA flows on TSMC A14 accelerate ...

An integrated methodology for accelerating process development and sustaining production control for advanced packaging ...

Intel is trying to catch up with TSMC in terms of process technologies and advanced global production capacity, but when it comes to the U.S., the chip giant remains unrivalled. Intel's Fab 52 is more ...

Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X. Synopsys, Inc. announced its ongoing close ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...